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model
specification
DRAM type
capacity
framework
speed
working voltage
operation temperature
product details
KLMCG4JEUD-B04P
eMMC
SAMSUNG/三星
64GB
1.8/3.3V
-40℃~85℃
BGA
Mass Production
11.5mm x 13mm x 1.2mm
5.1
HS400
Click view
KLMBG4GEUF-B04Q
32GB
-40℃~105℃
11.5mm x 13mm x 0.8mm
KLM8G1GEUF-B04Q
8GB
K4UJE3Q4AA-TFCL
DRAM LPDDR4X
48Gb
x32
4266Mbps
1.8/1.1/0.6V
-40°C~95°C
FBGA-200
K4UJE3Q4AA-THCL
K4UBE3D4AM-TFCL
32Gb
K4UBE3D4AM-THCL
K4FBE3D4HM-TFCL
DRAM LPDDR4
1.8/1.1/1.1V
K4FBE3D4HM-GFCL
3733Mbps
K4FBE3D4HM-THCL
K4FHE3D4HA-TFCL
24Gb
K4FHE3D4HA-GFCL
K4FHE3D4HA-THCL
K4F6E3S4HM-TFCL
16Gb
K4F6E3S4HM-THCL
K4F8E3S4HD-GHCL
8Gb
K4B4G1646D-BFMA
DRAM DDR3
4Gb
256Mx16
1866Mbps
1.35V
FBGA-96
K4B4G1646D-BHMA
K4B2G1646F-BFMA
2Gb
128Mx16
K4B2G1646F-BHMA