Powerful brand new chip ·Brand new·discounted·and abundant
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model
specification
DRAM type
capacity
framework
speed
working voltage
operation temperature
product details
THGAMRG8T13BAIL
eMMC
KIOXIA/铠侠
32GB
400Mb/s
1.70-1.95
-25 to 85
11.5x13.0x0.8
PDF
eMMC5.1
Click view
THGBMJG6C1LBAU7
8GB
-40 to 105
11.5x13.0x1.0
eMMC 5.1
Process: FG NAND
THGBMAG6A2JBAIR
Toshiba/KIOXIA东芝/铠侠
BGA
TYCOFH121597RA
eMCP
BGA-162
THGBMBG6D1KBAIL
-25°C~85°C
FBGA-153
THGJFAT1T84BAIR
UFS
256GB
2320mb/s
2.4V~3.6V
-25℃~85℃
BGA-153
11.5mm×13.0mm×1.0mm
3.1
TC58BVG1S3HTA00
FLASH
2GB
2.7V~3.6V
0℃~70℃
TSOP-48
(2048+64)x8 bit
(128K+4K)x8 bit
24nm
THGBMHG6C1LBAIL
11.5mm×13.0mm×0.8mm
15nm
THGBMVG8T13BAIL
THGBMVG7T13BAIL
THGJFAT2T84BAIR
215GB
THGJFAT0T44BAIL
128GB
THGAF8T1T83BAIR
1160mb/s
11.5mm×13.0mm
2.1
TH58NVG3S0HTAI0
-40℃~85℃
(4096+256)x8 bit
(256K+16K)x8 bit
TC58NVG5H2HTAI0
8k bytes
1M bytes
TC58NVG2S0HTA00
4GB
TC58NVG2S0HBAI4
FBGA-63
TC58NVG1S3HTAI0
(2048+128)x8 bit
(128K+8K)x8 bit
TC58NVG1S3HTA00
TC58NVG1S3HBAI4