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model
specification
DRAM type
capacity
framework
speed
working voltage
operation temperature
product details
K3UH5H5OMM-AGCJ
DRAM LPDDR4X
SAMSUNG/三星
32Gb
x64
3733Mbps
1.8/1.1/0.6V
-25°C~85°C
FBGA-556
Mass Production
Click view
K3QF4F40BM-AGCF
DRAM LPDDR3
1866Mbps
1.8/1.2/1.2V
FBGA-253
K4ABG165WA-MCTD
DRAM DDR4
2Gx16
2666Mbps
1.2V
0°C~85°C
FBGA-96
K4ABG165WA-MCWE
3200Mbps
KLUCG2K1EA-B0C1
UFS
64GB
1.8/3.3V
BGA-153
EOL
11.5mm x13mm x1.0mm
2.1
G3 2Lane
KLMBG2JENB-B041
eMMC
32GB
FBGA-153
Archived
5.1
HS400
K4A4G165WF-BCTD
4Gb
256Mx16
K4B4G1646E-BCNB
DRAM DDR3
512Mx8
2133Mbps
1.5V
K4B4G1646E-BYMA
1.35V
K4ZAF325BM-HC16
DRAM GDDR6
16Gb
512Mx32
16.0Gbps
FBGA-180
KLMDG4UCTB-B041
128GB
BGA
11.5mm x 13mm x 1.0mm
K4ABG165WB-MCWE
K4ABG085WA-MCTD
4Gx8
FBGA-78
K4AAG165WB-MCTD
1Gx16
K4AAG165WB-BCWE
4Gx4
K4AAG165WA-BIWE
-40°C~95°C
KLUDG8J1ZD-C0CP
11.5mm x 13mm x 1.2mm
KLUDG8J1ZD-C0CQ
-40℃~105℃
KLUCG4J1ZD-C0CP
KLUCG4J1ZD-C0CQ