Powerful brand new chip ·Brand new·discounted·and abundant
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model
specification
DRAM type
capacity
framework
speed
working voltage
operation temperature
product details
THGBMJG8C2LBAIL
eMMC
Toshiba/KIOXIA东芝/铠侠
32GB
2.7V~3.6V
-25℃~85℃
BGA-153
11.5mm×13.0mm×0.8mm
5.1
15nm
Click view
THGBMJG7C1LBAIL
16GB
THGBMJG6C1LBAU7
8GB
400mb/s
-40℃~105℃
11.5mm×13.0mm×1.0mm
THGBMJG6C1LBAIL
THGBMBG6D1KBAIL
-25°C~85°C
FBGA-153
THGBMAG6A2JBAIR
BGA
THGBM4G5D1HBAIR
THGAMVT0T43BAIR
128GB
THGAMVG9T23BAIL
64GB
THGAMRT0T43BAIR
THGAMRG9T23BAIL
THGAMRG8T13BAIL
THGAMRG7T13BAIL
TYCOFH121597RA
eMCP
BGA-162
THGAMVG8T13BAIL
KIOXIA铠侠
11.5mm×13mm×0.8mm
HS400
MT53E1G32D4NQ-046 WT:F
DRAM LPDDR4
MICRON/美光
32Gb
x32
FBGA
D9ZGW
MT53E2G32D4NQ-046WT:A
64Gb
D9ZCL
MT52L1G32D4PG-107 WT:B
DRAM LPDDR3
1866mb/s
1.8V/1.2V
-30°C~85°C
FBGA-178
D9SSK
1.071ns
MT52L512M32D2PF-107 WT:B
16Gb
D9SSF
MT52L256M32D1PF-107 WT:B
8Gb
D9SRZ