Powerful brand new chip ·Brand new·discounted·and abundant
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model
specification
brand
capacity
framework
speed
working voltage
operation temperature
product details
KLM8G1GEUF-B04P
eMMC
SAMSUNG/三星
8GB
1.8/3.3V
-40℃~85℃
FBGA-153
Mass Production
11.5mm x 13mm x 0.8mm
5.1
HS400
Click view
KLM8G1WEMB-B031
2.7V~3.6V
-25°C~85°C
5.0
KLM8G1WEPD-B031
BGA-153
Archived
KLMAG1JENB-B041
16GB
KLMAG2GESD-B04P
16Gb
hS400
KLMAG2GESD-B04Q
-40℃~105℃
KLMBG4GE4A-A001
32GB
FBGA-169
12mm x 16mm x 1.0mm
4.41
KLMBG4GEND-B031
11.5mm x 13mm x 1.0mm
KLMBG4GESD-B03P
KLMBG4GESD-B04P
BGA
KLMBG4GESD-B04Q
KLMBG4GEUF-B04P
KLMCG2KETM-B041
64GB
KLMCG2UCTB-B041
KLMCG8GESD-B04P
KLMDG4UCTA-B041
128GB
EOL
KLMDG8JENB-B041
11.5mm x 13mm x 1.2mm
KLMDG8JEUD-B04Q
KLMCG4JETD-B041
KLMBG4GESD-B02P